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Apple M5 will use TSMC’s advanced 3NM chip technology

Published

2 years ago

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Mac Studio

Apple will use TSMC’s advanced 3nm chipset processing technology for its next year’s M5 series processors for Mac devices reveals Supply chain analyst Ming-Chi Kuo.

Here’s what Kuo revealed:

The M5 series chips will adopt TSMC’s advanced N3P node, which entered the prototype phase a few months ago. M5, M5 Pro/Max, and M5 Ultra mass production is expected in 1H25, 2H25, and 2026, respectively.

Apple Mac

Apple Mac (Image Credit: Apple)

The M5 Pro, Max, and Ultra will utilize server-grade SoIC packaging. Apple will use 2.5D packaging called SoIC-mH (molding horizontal) to improve production yields and thermal performance, featuring separate CPU and GPU designs.

Apple’s PCC infrastructure build-out will accelerate after the mass production of the high-end M5 chips, better suited for AI inferencing.

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Mannoo specializes in Generative AI, Large Language Model (LLM), and Aerospace Science. Prior to delving into these fields, he was a Python programmer, a game designer, and an Android and iOS app developer with over 5 years of experience. He has prior writing experience in creative writing about smartphones and technology before working at Eonmsk.com. You can explore his X/TWitter and LinkedIn pages or contact him through his email.

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